2608.17125
2026-08-19
cond-mat.supr-con
cond-mat.mes-hall
physics.app-ph
新提交
71%
Demonstration of a scalable all-solid-state refrigerator exploiting diffusion geometries and limiting interfacial conductances at temperatures below 1
利用扩散几何结构和界面限域电导的可扩展全固态冰箱在1开尔文以下温度的演示
Northrop Grumman Microelectronics Design, Applications Team, :, Robert M. Young, Zachary Stegen, John X. Przybysz, Edward R. Engbrecht, Aaron A. Hathaway, Justin C. Hackley, Kirby B. Myers, Christian C. Thorpe, Aurelius L. Graninger, Robert Miller, Diego A. Morales, Roberto D. Carcamo, Glen Walters, Jeric P. Sarad, Nicholas F. Pleim, Seth Whitsitt, Joshua T. Shipman, Anil Erol, Melissa G. Loving, Evan Donohue, Corey A. Kegerreis, Benjamin Dalfort, Moe S. Khalil, Christopher Pinion, Randi Jaramillo, John Milinichik, Sandro J. Di Giacomo, Thomas Zodda, Nilesh Tralshawala, Gregory R. Boyd, Jonathan M. Cochran, Katherine A. Maddock, Michael P. De Feo, Aaron A. Pesetski, Marc E. Sherwin
专题命中
扩散模型
:diffusion(title)
AI总结
该研究开发了采用NIS结、含1121个SINIS单元的可扩展全固态冰箱,首次实现了低于1开尔文下对整个硅芯片的冷却,将其声子温度降至70毫开尔文。